Invention Grant
- Patent Title: Semiconductor device structure and methods of forming the same
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Application No.: US17184877Application Date: 2021-02-25
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Publication No.: US11652140B2Publication Date: 2023-05-16
- Inventor: Chi-Yi Chuang , Cheng-Ting Chung , Hou-Yu Chen , Kuan-Lun Cheng
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Nz Carr Law Office
- Main IPC: H01L29/06
- IPC: H01L29/06 ; H01L27/11 ; H01L29/423 ; H01L29/40 ; H01L29/786 ; H01L29/66

Abstract:
A semiconductor device structure, along with methods of forming such, are described. The structure includes first and second source/drain epitaxial features, a first gate electrode layer disposed between the first and second source/drain epitaxial features, third and fourth source/drain epitaxial features, a second gate electrode layer disposed between the third and fourth source/drain epitaxial features, fifth and sixth source/drain epitaxial features disposed over the first and second source/drain epitaxial features, and a third gate electrode layer disposed between the fifth and sixth source/drain epitaxial features. The third gate electrode layer is electrically connected to the second source/drain epitaxial feature. The structure further includes a seventh source/drain epitaxial feature disposed over the third source/drain epitaxial feature and an eighth source/drain epitaxial feature disposed over the fourth source/drain epitaxial feature. The second gate electrode layer is disposed between the seventh and eighth source/drain epitaxial features.
Public/Granted literature
- US20220271122A1 SEMICONDUCTOR DEVICE STRUCTURE AND METHODS OF FORMING THE SAME Public/Granted day:2022-08-25
Information query
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