The present disclosure provides a trench field effect transistor and a manufacturing method. The manufacturing method includes: providing a semiconductor substrate, forming an epitaxial layer, a first trench, a second trench, a first gate dielectric layer, a first gate structure, a second gate dielectric layer, a second gate structure, and a body region, forming a source implantation mask, performing ion implantation based on the source implantation mask to form a source, and forming a source electrode structure. Self-aligned source implantation is implemented by designing a source implantation mask, and a body region lead-out region is formed while forming a source, so that the source and the body region are directly led out. The present disclosure uses a self-alignment technique to further reduce a cell dimension, and enables equal-potential electrical lead-out of the source and the body region without providing a source contact hole.