Invention Grant
- Patent Title: Contact for semiconductor device and method of forming thereof
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Application No.: US17389034Application Date: 2021-07-29
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Publication No.: US11652171B2Publication Date: 2023-05-16
- Inventor: Huei-Shan Wu , Yi-Lii Huang
- Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Slater Matsil, LLP
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L29/10 ; H01L27/088 ; H01L29/417 ; H01L21/768 ; H01L29/66 ; H01L21/8234 ; H01L23/522

Abstract:
A semiconductor device comprises a first gate electrode on a substrate, a first conductive contact on the first gate electrode, an etch stop layer (ESL) on the first conductive contact, and a second conductive contact extending through the ESL. The first conductive contact has a first width. The second conductive contact has a second width, the second width being smaller than the first width. The ESL overhangs a portion of the second conductive contact. A convex bottom surface of the second conductive contact physically contacts a concave top surface of the first conductive contact.
Public/Granted literature
- US20220271163A1 CONTACT FOR SEMICONDUCTOR DEVICE AND METHOD OF FORMING THEREOF Public/Granted day:2022-08-25
Information query
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