Invention Grant
- Patent Title: Semiconductor component with oxidized aluminum nitride film and manufacturing method thereof
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Application No.: US17204916Application Date: 2021-03-17
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Publication No.: US11652190B2Publication Date: 2023-05-16
- Inventor: Jing-Cheng Lin
- Applicant: SKY TECH INC.
- Applicant Address: TW Hsinchu County
- Assignee: SKY TECH INC.
- Current Assignee: SKY TECH INC.
- Current Assignee Address: TW Hsinchu County
- Agency: Hdls Ipr Services
- Agent Chun-Ming Shih
- Priority: TW 9145098 2020.12.18
- Main IPC: H01L33/00
- IPC: H01L33/00 ; H01L33/32 ; H01L33/06 ; C30B29/40 ; C23C14/56 ; H01L21/67 ; C23C14/54

Abstract:
The present disclosure is a light-emitting diode (LED) with oxidized aluminum nitride (oxidized-AlN) film, which includes a substrate, an aluminum nitride buffer (AlN-buffer) layer, an oxidized-AlN film and a light-emitting diode epitaxial structure. The AlN-buffer layer is disposed on a patterned surface of the substrate, wherein the patterned surface is formed with a plurality of protrusions and a bottom portion. The oxidized-AlN film is disposed on the AlN-buffer layer on the protrusions, and with none disposed on the AlN-buffer layer on the bottom portion. The LED epitaxial structure includes gallium nitride compound crystal formed on the oxidized-AlN film and the AlN-buffer layer, to effectively reduce defect density of the gallium nitride compound crystal and to improve a luminous intensity of the LED.
Public/Granted literature
- US20220199860A1 SEMICONDUCTOR COMPONENT WITH OXIDIZED ALUMINUM NITRIDE FILM AND MANUFACTURING METHOD THEREOF Public/Granted day:2022-06-23
Information query
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