Invention Grant
- Patent Title: Method for producing an electronic device
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Application No.: US17171268Application Date: 2021-02-09
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Publication No.: US11652197B2Publication Date: 2023-05-16
- Inventor: Masafumi Kuramoto , Satoru Ogawa , Katsuaki Suganuma , Keun-Soo Kim
- Applicant: NICHIA CORPORATION
- Applicant Address: JP Anan
- Assignee: NICHIA CORPORATION
- Current Assignee: NICHIA CORPORATION
- Current Assignee Address: JP Anan
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: JP 08007583 2008.01.17
- The original application number of the division: US12596339
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01B1/02 ; B23K1/00 ; B23K35/02 ; H05K1/09

Abstract:
An object of the present invention is to provide a method for producing a conductive material that allows a low electric resistance to be generated, and that is obtained by using an inexpensive and stable conductive material composition containing no adhesive. The conductive material can be provided by a producing method that includes the step of sintering a first conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm, and a metal oxide, so as to obtain a conductive material. The conductive material can be provided also by a method that includes the step of sintering a second conductive material composition that contains silver particles having an average particle diameter (median diameter) of 0.1 μm to 15 μm in an atmosphere of oxygen or ozone, or ambient atmosphere, at a temperature in a range of 150° C. to 320° C., so as to obtain a conductive material.
Public/Granted literature
- US20210167264A1 METHOD FOR PRODUCING AN ELECTRONIC DEVICE Public/Granted day:2021-06-03
Information query
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