Invention Grant
- Patent Title: Backplane connector for providing angled connections and system thereof
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Application No.: US17327817Application Date: 2021-05-24
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Publication No.: US11652321B2Publication Date: 2023-05-16
- Inventor: John C. Laurx , Chien-Lin Wang , Vivek Shah
- Applicant: Molex, LLC
- Applicant Address: US IL Lisle
- Assignee: Molex, LLC
- Current Assignee: Molex, LLC
- Current Assignee Address: US IL Lisle
- Main IPC: H01R13/6461
- IPC: H01R13/6461 ; H01R13/6587 ; H01R12/72 ; H01R12/73 ; H01R13/518 ; H01R13/516

Abstract:
A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.
Public/Granted literature
- US20210281016A1 BACKPLANE CONNECTOR AND SYSTEM Public/Granted day:2021-09-09
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