The disclosure is directed to a power module apparatus that includes a base plate, a power substrate positioned relative to the base plate, at least two power contacts, a gate-source board mounted relative to the power substrate, gate drive connectors electrically connected to the gate-source board, a housing secured to the power substrate, and a clamping circuit electrically connected to the at least one power device. The clamping circuit being configured to clamp an input to a gate of the at least one power device. The clamping circuit being arranged with at least one of the following: the base plate, the power substrate, one of the at least two power contacts, the at least one power device, the gate-source board, the gate drive connectors, and the housing. The disclosure is further directed to a process of configuring a power module apparatus.