Invention Grant
- Patent Title: Optical module and method for manufacturing the same
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Application No.: US17447824Application Date: 2021-09-16
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Publication No.: US11653442B2Publication Date: 2023-05-16
- Inventor: Daisuke Noguchi
- Applicant: Lumentum Japan, Inc.
- Applicant Address: JP Kanagawa
- Assignee: Lumentum Japan, Inc.
- Current Assignee: Lumentum Japan, Inc.
- Current Assignee Address: JP Kanagawa
- Agency: Harrity & Harrity, LLP
- Priority: JP 2019001667 2019.01.09
- The original application number of the division: US16737354 2020.01.08
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/11 ; H05K1/18 ; H05K3/34 ; H01R12/62 ; H01R12/88 ; H04B10/50 ; H04B10/60 ; H04B10/516 ; H05K3/36

Abstract:
A printed circuit board includes a first transmission line provided on an insulating base, a first ground conductor, a notch portion that exposes a part of the first ground conductor, a conductor provided in the notch portion and electrically connected to the first ground conductor, and a first electrode exposed on a main surface of the insulating base facing a flexible board and electrically connected to the first transmission line. The flexible board includes a second transmission line provided on an insulating sheet, a second ground conductor, a second electrode exposed on a main surface of the insulating sheet facing the printed circuit board and connected to the second transmission line, and a third electrode exposed on the main surface of the insulating sheet and connected to the second ground conductor. The conductor and the third electrode are connected by solder.
Public/Granted literature
- US20220007495A1 OPTICAL MODULE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-01-06
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