Invention Grant
- Patent Title: Thermally conductive microtubes for evenly distributing heat flux on a cooling system
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Application No.: US17164562Application Date: 2021-02-01
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Publication No.: US11653475B2Publication Date: 2023-05-16
- Inventor: Ioannis Manousakis , Husam Atallah Alissa , Nicholas Andrew Keehn , Bharath Ramakrishnan
- Applicant: Microsoft Technology Licensing, LLC
- Applicant Address: US WA Redmond
- Assignee: Microsoft Technology Licensing, LLC
- Current Assignee: Microsoft Technology Licensing, LLC
- Current Assignee Address: US WA Redmond
- Agency: Ray Quinney & Nebeker P.C.
- Agent Paul N. Taylor
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K1/02 ; H05K1/18
Abstract:
An electronics cooling system includes a printed circuit board (PCB) assembly having a heat generating component connected to a base. A plurality of thermally conductive microtubes are connected to the PCB assembly with a first spatial density. The plurality of thermally conductive microtubes are connected to a heat plate of a cooling system with a second spatial density to evenly spread the heat flux of the PCB assembly over the heat plate.
Public/Granted literature
- US20220248557A1 THERMALLY CONDUCTIVE MICROTUBES FOR EVENLY DISTRIBUTING HEAT FLUX ON A COOLING SYSTEM Public/Granted day:2022-08-04
Information query
