Invention Grant
- Patent Title: Memory devices and methods of manufacturing thereof
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Application No.: US16786521Application Date: 2020-02-10
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Publication No.: US11653492B2Publication Date: 2023-05-16
- Inventor: Meng-Sheng Chang , Chia-En Huang , Yih Wang
- Applicant: Taiwan Semiconductor Manufacturing Company Limited
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING LIMITED
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING LIMITED
- Current Assignee Address: TW Hsinchu
- Agency: Foley & Lardner LLP
- Main IPC: H01L27/112
- IPC: H01L27/112 ; H01L27/088 ; H01L29/78 ; H01L29/04 ; H01L29/66 ; H01L29/06

Abstract:
A semiconductor device is disclosed. The semiconductor device includes a fin-based structure formed on a substrate. The semiconductor device includes a plurality of first nanosheets, vertically spaced apart from one another, that are formed on the substrate. The semiconductor device includes a first source/drain (S/D) region electrically coupled to a first end of the fin-based structure. The semiconductor device includes a second S/D region electrically coupled to both of a second end of the fin-based structure and a first end of the plurality of first nanosheets. The semiconductor device includes a third S/D region electrically coupled to a second end of the plurality of first nanosheets. The fin-based structure has a first crystal lattice direction and the plurality of first nano sheets have a second crystal lattice direction, which is different from the first crystal lattice direction.
Public/Granted literature
- US20210249423A1 MEMORY DEVICES AND METHODS OF MANUFACTURING THEREOF Public/Granted day:2021-08-12
Information query
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