Invention Grant
- Patent Title: Integrated circuit stress sensor
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Application No.: US17136413Application Date: 2020-12-29
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Publication No.: US11653568B2Publication Date: 2023-05-16
- Inventor: Baher Haroun , Tobias Bernhard Fritz , Michael Szelong , Ernst Muellner
- Applicant: TEXAS INSTRUMENTS INCORPORATED
- Applicant Address: US TX Dallas
- Assignee: Texas Instmments Incorporated
- Current Assignee: Texas Instmments Incorporated
- Current Assignee Address: US TX Dallas
- Agent Michael T. Gabrik; Frank D. Cimino
- Main IPC: H01L41/113
- IPC: H01L41/113 ; H01L27/20 ; G01L1/18 ; H01L41/311 ; H01L25/16 ; H01L23/31 ; H01L41/053

Abstract:
An integrated circuit is described herein that includes a semiconductor substrate. First and second piezoresistive sensors are on or in the substrate where each have a respective sensing axis extending in first and second directions respectively parallel with a surface of the substrate, where the second direction is perpendicular to the first direction. A third piezoresistive sensor is on or in the substrate and has a respective sensing axis extending in a third direction parallel with the surface of the substrate and neither parallel nor perpendicular to the first and second directions.
Public/Granted literature
- US20210210473A1 INTEGRATED CIRCUIT STRESS SENSOR Public/Granted day:2021-07-08
Information query
IPC分类: