Invention Grant
- Patent Title: Endoscope and endoscope system
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Application No.: US16939585Application Date: 2020-07-27
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Publication No.: US11653819B2Publication Date: 2023-05-23
- Inventor: Norihito Yamada , Madoka Saito , Shigetoshi Futami
- Applicant: OLYMPUS CORPORATION
- Applicant Address: JP Tokyo
- Assignee: OLYMPUS CORPORATION
- Current Assignee: OLYMPUS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Scully, Scott, Murphy & Presser, P.C.
- Priority: JP 2018044032 2018.03.12
- Main IPC: A61B1/00
- IPC: A61B1/00 ; A61B1/04 ; A61B1/12

Abstract:
An endoscope provides a connector substrate of an endoscope connector to be connected to a processor with a temperature sensor for directly measuring a temperature of the connector substrate, performs control to restrict a power supply (in other words, limit and stop a power supply) from an endoscope power supply circuit according to the measured temperature of the connector substrate (in other words, the endoscope connector), and thereby appropriately manages the temperature of the endoscope connector in the endoscope.
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