A temperature control device for a chemical liquid used in a semiconductor manufacturing process. The device includes: a first heat sink having a cooling water flow path formed therein; a plurality of thermoelectric modules coming into contact with both side surfaces of the first heat sink, respectively; and a second heat sink coming into contact with the thermoelectric modules. The second heat sink includes first and second heat sink blocks, a chemical liquid inlet tube and a chemical liquid outlet tube connected to the first and second heat sink blocks, and a plurality of chemical liquid flow path tubes inserted into the insides of the first and second heat sink blocks in such a manner as to communicate with one another and with the chemical liquid inlet tube and the chemical liquid outlet tube, respectively, to flow the chemical liquid therealong.