Invention Grant
- Patent Title: Engineering reversible elasticity in ductile or brittle thin films and products resulting from said engineering
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Application No.: US16465554Application Date: 2017-11-29
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Publication No.: US11654609B2Publication Date: 2023-05-23
- Inventor: Nicolas Vachicouras , Christina Myra Tringides , Stephanie P. Lacour
- Applicant: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Applicant Address: CH Lausanne
- Assignee: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Current Assignee: ECOLE POLYTECHNIQUE FEDERALE DE LAUSANNE (EPFL)
- Current Assignee Address: CH Lausanne
- Agency: Seed Intellectual Property Law Group LLP
- International Application: PCT/EP2017/080876 2017.11.29
- International Announcement: WO2018/100005A 2018.06.07
- Date entered country: 2019-05-30
- Main IPC: B32B3/26
- IPC: B32B3/26 ; B32B15/08 ; B29C59/00 ; H01B13/00 ; B29C55/02 ; B29C55/10 ; B29D28/00 ; B29K79/00

Abstract:
The present disclosure relates to how to engineer reversible elasticity in thin films and/or layers and/or substrates, using a repeated Y-shaped motif, which is cut out through the film and/or layer and/or substrate. As an example, using a 75 μm thick polyimide (PI) foil, macroscopic dog-bone shaped structures with a range of geometrical parameters of the Y shape have been prepared according to an embodiment of the present disclosure. The tensile strain response of the film at its point of fracture was then recorded. The structures were also confirmed using finite element modeling. Upon stretching, the PI ligaments locally deflect out of plane, allowing the foil to macroscopically stretch.
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