Invention Grant
- Patent Title: Method for manufacturing polyimide composite film for flexible metal-clad substrate
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Application No.: US17355204Application Date: 2021-06-23
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Publication No.: US11655348B2Publication Date: 2023-05-23
- Inventor: Jia-Hao Wu , Chia-Ying Chou , Chun-Yi Cheng
- Applicant: TAIMIDE TECHNOLOGY INCORPORATION
- Applicant Address: TW Hsinchu Hsien
- Assignee: TAIMIDE TECHNOLOGY INCORPORATION
- Current Assignee: TAIMIDE TECHNOLOGY INCORPORATION
- Current Assignee Address: TW Hsinchu Hsien
- Main IPC: C08J5/18
- IPC: C08J5/18 ; C08J7/04 ; C08J3/11 ; C08G73/10 ; C08J3/24 ; C08L33/24

Abstract:
A method for manufacturing a polyimide composite film for a flexible metal-clad substrate includes the following steps, providing a polyamide acid solution; providing fluorine polymer particles and mixing the fluorine polymer particles with a dispersant and an organic solution to prepare a fluorine polymer particle dispersion; forming a colloidal polyimide film from the polyamide acid solution; and coating the colloidal polyimide film with the fluorine polymer particle dispersion and then performing baking to form a polyimide composite film.
Public/Granted literature
- US20220411594A1 METHOD FOR MANUFACTURING POLYIMIDE COMPOSITE FILM FOR FLEXIBLE METAL-CLAD SUBSTRATE Public/Granted day:2022-12-29
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