Invention Grant
- Patent Title: Methods and apparatus for adjusting wafer performance using multiple RF generators
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Application No.: US16912887Application Date: 2020-06-26
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Publication No.: US11655540B2Publication Date: 2023-05-23
- Inventor: Chong Jiang , Malcolm Delaney
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: C23C16/52
- IPC: C23C16/52 ; C23C16/455 ; C23C16/505

Abstract:
Methods and apparatus for controlling a semiconductor process leverage phase shifting between at least two RF generators to improve wafer performance parameters. In some embodiments, an apparatus may include a first radio frequency (RF) generator, a second RF frequency generator, a cable connected between the first RF generator and the second RF generator wherein the cable is configured to synchronize the first RF generator and the second RF generator, and an adjustable phase shift assembly with a two-dimensional trace and an adjustable contact point. The adjustable phase shift assembly is connected to the cable and configured to alter at least one water performance parameter by changing a phase shift relationship between the first RF frequency generator and the second RF frequency generator.
Public/Granted literature
- US20210404065A1 METHODS AND APPARATUS FOR ADJUSTING WAFER PERFORMANCE USING MULTIPLE RF GENERATORS Public/Granted day:2021-12-30
Information query
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