Invention Grant
- Patent Title: Micro-coaxial wire interconnect architecture
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Application No.: US16473378Application Date: 2017-03-31
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Publication No.: US11656247B2Publication Date: 2023-05-23
- Inventor: Ronald Michael Kirby , Erkan Acar , Joe Walczyk , Youngseok Oh , Justin M Huttula , Mohanraj Prabhugoud
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwegman Lundberg & Woesnner, P.A.
- International Application: PCT/US2017/025538 2017.03.31
- International Announcement: WO2018/182727A 2018.10.04
- Date entered country: 2019-06-25
- Main IPC: G01R1/07
- IPC: G01R1/07 ; G01R1/04 ; G01R1/073

Abstract:
A coaxial wire interconnect architecture and associated methods are described. In one example, the coaxial wire interconnect architecture is used in a test socket interconnect array. Flexible bends are formed in one or more of the coaxial wire interconnects to provide compliant connections to an electronic device during testing.
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