Invention Grant
- Patent Title: Switching power supply module and packaging method thereof
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Application No.: US15931609Application Date: 2020-05-14
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Publication No.: US11657947B2Publication Date: 2023-05-23
- Inventor: Wenjie Wang , Dafu Lu
- Applicant: Shenzhen Sunlord Electronics Co., Ltd.
- Applicant Address: CN Guangdong
- Assignee: Shenzhen Sunlord Electronics Co., Ltd.
- Current Assignee: Shenzhen Sunlord Electronics Co., Ltd.
- Current Assignee Address: CN Guangdong
- Agent Winston Hsu
- Priority: CN 1711161014.1 2017.11.20
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H01F27/24 ; H01F27/29 ; H01L23/495 ; H01L23/00 ; H01L25/16 ; H01F41/02

Abstract:
A switching power supply module includes a power inductor which includes a magnetic core and L-shaped metal end electrodes and a switching power supply chip which includes a packaging body, a bare chip and a bottom bonding pad of the bare chip; the L-shaped metal end electrode includes a first electrode part which is welded at 90° to the magnetic core and a second electrode part which extends in parallel from the first electrode part to the middle of the magnetic core and is perpendicular to the first electrode part; the bare chip and the packaging body are embedded between the first, the second electrode part and the magnetic core; the bottom bonding pad abuts between the two second electrode parts and is insulated from the second electrode part, and the weld face of the bottom bonding pad is flush with that of the second electrode part.
Public/Granted literature
- US20200273616A1 Switching Power Supply Module and Packaging Method thereof Public/Granted day:2020-08-27
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