Invention Grant
- Patent Title: Coil component
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Application No.: US17031734Application Date: 2020-09-24
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Publication No.: US11657952B2Publication Date: 2023-05-23
- Inventor: Kenichi Araki , Keiichi Ishida
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 2019179011 2019.09.30
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H01F27/255 ; H01F41/063 ; H01F41/12 ; H01F41/02 ; H01F27/32

Abstract:
A coil component is capable of suppressing occurrence of peeling at an interface between a coil conductor and resin in a magnetic portion due to heating during mounting. The coil component includes an element body that includes a coil conductor formed by winding a conductive wire coated with an insulating film, and a magnetic portion that contains metal magnetic particles and resin, and external electrodes that are electrically connected to exposed surfaces of extended portions of the coil conductor exposed on a surface of the element body, and are arranged on the surface of the element body. The metal magnetic particles are arranged in recesses formed in a surface of the conductive wire in the extended portions of the coil conductor.
Public/Granted literature
- US20210098183A1 COIL COMPONENT Public/Granted day:2021-04-01
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