Invention Grant
- Patent Title: Multilayer capacitor and board having the same
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Application No.: US17231107Application Date: 2021-04-15
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Publication No.: US11657968B2Publication Date: 2023-05-23
- Inventor: Hyung Joon Kim , Jung Ho Shim
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20200159975 2020.11.25
- Main IPC: H01G4/012
- IPC: H01G4/012 ; H01G4/30 ; H01G2/06 ; H01G4/008 ; H01G4/232 ; H01G4/12

Abstract:
A multilayer capacitor includes: a capacitor body including first and second dielectric layers, internal electrodes, and including first to six surfaces; first and second external electrodes disposed on the third and fourth surfaces, respectively; and third and fourth external electrodes disposed on the fifth and sixth surfaces, respectively. The internal electrodes include: first internal electrode disposed on the first dielectric layer, having both ends connected to the first and second external electrodes, respectively, and having a hole; a second internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode and be connected to the third external electrode; and a third internal electrode disposed on the second dielectric layer so as to overlap a portion of the first internal electrode, be spaced apart from the second internal electrode, and be connected to the fourth external electrode.
Public/Granted literature
- US20220165494A1 MULTILAYER CAPACITOR AND BOARD HAVING THE SAME Public/Granted day:2022-05-26
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