Invention Grant
- Patent Title: Multi-layer ceramic electronic component
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Application No.: US17702230Application Date: 2022-03-23
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Publication No.: US11657975B2Publication Date: 2023-05-23
- Inventor: In Kyung Jung , Dong Hwi Shin
- Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Morgan, Lewis & Bockius LLP
- Priority: KR 20190108008 2019.09.02
- Main IPC: H01G4/232
- IPC: H01G4/232 ; H01G4/30

Abstract:
A multilayer ceramic electronic component includes a ceramic body, and first and second external electrodes disposed on the surface of the ceramic body, respectively. The ceramic body includes a capacitance forming portion including a dielectric layer and internal electrodes, margin portions disposed on both sides of the capacitance forming portion, and cover portions disposed on both sides of the capacitance forming portion. The first and second external electrodes include first and second base electrodes, respectively, first and second conductive layers disposed on edges of the first and second base electrodes, respectively, and first and second terminal electrodes covering the first and second base electrodes, respectively.
Public/Granted literature
- US20220216009A1 MULTI-LAYER CERAMIC ELECTRONIC COMPONENT Public/Granted day:2022-07-07
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