Invention Grant
- Patent Title: Apparatuses and methods of protecting nickel and nickel containing components with thin films
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Application No.: US16846295Application Date: 2020-04-11
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Publication No.: US11658014B2Publication Date: 2023-05-23
- Inventor: Pingyan Lei , Dien-Yeh Wu , Xiao Ming He , Jennifer Y. Sun , Lei Zhou , Takashi Kuratomi , Avgerinos V. Gelatos , Mei Chang , Steven D. Marcus
- Applicant: APPLIED MATERIALS, INC.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Moser Taboada
- Main IPC: C23C16/06
- IPC: C23C16/06 ; C23C16/44 ; H01J37/32 ; H01L21/67 ; C23C16/455 ; H01L21/285
Abstract:
Methods and apparatus for depositing a coating on a semiconductor manufacturing apparatus component are provided herein. In some embodiments, a method of depositing a coating on a semiconductor manufacturing apparatus component includes: sequentially exposing a semiconductor manufacturing apparatus component including nickel or nickel alloy to an aluminum precursor and a reactant to form an aluminum containing layer on a surface of the semiconductor manufacturing apparatus component by a deposition process.
Public/Granted literature
- US20210319983A1 APPARATUSES AND METHODS OF PROTECTING NICKEL AND NICKEL CONTAINING COMPONENTS WITH THIN FILMS Public/Granted day:2021-10-14
Information query
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