Invention Grant
- Patent Title: Method for forming semiconductor structure
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Application No.: US17375211Application Date: 2021-07-14
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Publication No.: US11658023B2Publication Date: 2023-05-23
- Inventor: Zhen-Zhen Wang , Jian-Jun Zhang
- Applicant: UNITED MICROELECTRONICS CORP.
- Applicant Address: TW Hsinchu
- Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee: UNITED MICROELECTRONICS CORP.
- Current Assignee Address: TW Hsinchu
- Agency: WPAT, P.C
- Priority: CN 1910559598.0 2019.06.26
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01L21/768 ; H01L29/40 ; H01L29/423

Abstract:
A method for forming a semiconductor structure is provided, which comprises the following steps. A gate is formed by a method comprising the following steps. A gate dielectric layer is formed on a substrate. A gate electrode is formed on the gate dielectric layer. A nitride spacer is formed on a sidewall of the gate electrode. A phosphorus containing dielectric layer is formed on the gate. The phosphorus containing dielectric layer has a varied phosphorus dopant density distribution profile. The phosphorus containing dielectric layer comprises a phosphorus dopant density region on an upper surface of the gate and having a triangle-like shape.
Public/Granted literature
- US20210343523A1 METHOD FOR FORMING SEMICONDUCTOR STRUCTURE Public/Granted day:2021-11-04
Information query
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