Invention Grant
- Patent Title: Plasma processing method
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Application No.: US16957878Application Date: 2019-06-26
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Publication No.: US11658040B2Publication Date: 2023-05-23
- Inventor: Masaaki Taniyama , Kenichi Kuwahara , Satoshi Une
- Applicant: Hitachi High-Tech Corporation
- Applicant Address: JP Tokyo
- Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee: HITACHI HIGH-TECH CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Miles & Stockbridge, P.C.
- International Application: PCT/JP2019/025449 2019.06.26
- International Announcement: WO2020/100339A 2020.05.22
- Date entered country: 2020-06-25
- Main IPC: H01L21/311
- IPC: H01L21/311 ; H01L21/3065 ; H01L21/3213 ; H01L21/308

Abstract:
The invention provides a plasma processing method in which plasma etching is performed on a film to be etched by using a mask, the plasma processing method including: a deposition step of depositing a deposition film containing a boron element on the mask while a radio frequency power is supplied to a sample table on which a sample formed with the film to be etched is placed; and an etching step of etching the film to be etched by using plasma after the deposition step.
Information query
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