Invention Grant
- Patent Title: Electronic module
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Application No.: US16078602Application Date: 2017-07-14
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Publication No.: US11658109B2Publication Date: 2023-05-23
- Inventor: Kosuke Ikeda , Osamu Matsuzaki
- Applicant: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Applicant Address: JP Tokyo
- Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee: SHINDENGEN ELECTRIC MANUFACTURING CO., LTD.
- Current Assignee Address: JP Tokyo
- Agency: Ladas & Parry, LLP
- International Application: PCT/JP2017/025641 2017.07.14
- International Announcement: WO2019/012678A 2019.01.17
- Date entered country: 2018-08-21
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/495 ; H01L23/538 ; H01L23/00 ; H01L25/07

Abstract:
An electronic module has a first substrate 11, a first electronic element 13, a second electronic element 23, a second substrate 21, a first terminal part 110 provided on a side of the first substrate 11 and a second terminal part 120 provided on a side of the second substrate 21. The first terminal part 110 has a first surface direction extending part 114 and a first normal direction extending part 113 extending toward one side or the other side. The second terminal part 120 has a second surface direction extending part 124 and a second normal direction extending part 123 extending toward one side or the other side. The second surface direction extending part 124 is provided on one side of the first surface direction extending part 114, and the first surface direction extending part 114 and the second surface direction extending part 124 overlap one another in a surface direction.
Public/Granted literature
- US20210210422A1 ELECTRONIC MODULE Public/Granted day:2021-07-08
Information query
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