Invention Grant
- Patent Title: Semiconductor device having a plurality of bipolar transistors with different heights between their respective emitter layers and emitter electrodes
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Application No.: US17188961Application Date: 2021-03-01
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Publication No.: US11658180B2Publication Date: 2023-05-23
- Inventor: Isao Obu , Shigeki Koya , Yasunari Umemoto , Takayuki Tsutsui
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 2018136042 2018.07.19
- Main IPC: H01L27/082
- IPC: H01L27/082 ; H01L23/00 ; H01L29/205 ; H01L29/73 ; H01L29/737 ; H01L29/66 ; H01L23/498 ; H01L21/8252 ; H03F3/20 ; H03F1/56

Abstract:
A semiconductor device has a semiconductor substrate, and multiple first bipolar transistors on the first primary surface side of the semiconductor substrate. The first bipolar transistors have a first height between an emitter layer and an emitter electrode in the direction perpendicular to the first primary surface. The semiconductor device further has at least one second bipolar transistor on the first primary surface side of the semiconductor substrate. The second bipolar transistor have a second height, greater than the first height, between an emitter layer and an emitter electrode in the direction perpendicular to the first primary surface. Also, the semiconductor has a first bump stretching over the multiple first bipolar transistors and the at least one second bipolar transistor.
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