Invention Grant
- Patent Title: Backside gate contact
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Application No.: US17228955Application Date: 2021-04-13
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Publication No.: US11658226B2Publication Date: 2023-05-23
- Inventor: Huan-Chieh Su , Chun-Yuan Chen , Li-Zhen Yu , Lin-Yu Huang , Lo-Heng Chang , Cheng-Chi Chuang , Chih-Hao Wang
- Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Haynes and Boone, LLP
- Main IPC: H01L29/423
- IPC: H01L29/423 ; H01L29/06 ; H01L21/8234 ; H01L29/786

Abstract:
Semiconductor structures and methods of forming the same are provided. A semiconductor structure according to one embodiment includes first nanostructures, a first gate structure wrapping around each of the first nanostructures and disposed over an isolation structure, and a backside gate contact disposed below the first nanostructures and adjacent to the isolation structure. A bottom surface of the first gate structure is in direct contact with the backside gate contact.
Public/Granted literature
- US20220271138A1 BACKSIDE GATE CONTACT Public/Granted day:2022-08-25
Information query
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