- Patent Title: Metal body formed on a component carrier by additive manufacturing
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Application No.: US16152659Application Date: 2018-10-05
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Publication No.: US11659648B2Publication Date: 2023-05-23
- Inventor: Marco Gavagnin , Jonathan Silvano de Sousa
- Applicant: AT&S Austria Technologie & Systemtechnik Aktiengesellschaft
- Applicant Address: AT Leoben
- Assignee: AT&S Austria Technologie & Systemtechnik AG
- Current Assignee: AT&S Austria Technologie & Systemtechnik AG
- Current Assignee Address: AT Leoben
- Agency: Smith Tempel Blaha LLC
- Agent Robert A. Blaha
- Priority: EP 195322 2017.10.06
- Main IPC: H05K1/02
- IPC: H05K1/02 ; H05K1/09 ; H05K1/03 ; H05K3/46 ; H05K1/18 ; B22F7/08 ; B33Y80/00 ; B33Y10/00 ; H05K3/12 ; B22F10/20
Abstract:
A component carrier includes a carrier body formed of a plurality of electrically conductive layer structures and/or electrically insulating layer structures, a metal surface structure coupled to the layer structures and a metal body directly on the metal surface structure formed by additive manufacturing.
Public/Granted literature
- US20190110357A1 Metal Body Formed on a Component Carrier by Additive Manufacturing Public/Granted day:2019-04-11
Information query
