Invention Grant
- Patent Title: Ceramic electronic component
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Application No.: US17308250Application Date: 2021-05-05
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Publication No.: US11659659B2Publication Date: 2023-05-23
- Inventor: Naoya Murakita , Yoshihito Otsubo , Issei Yamamoto , Yuta Morimoto
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Kyoto
- Agency: Pearne & Gordon LLP
- Priority: JP 2018210868 2018.11.08
- Main IPC: H05K1/03
- IPC: H05K1/03 ; H05K1/02 ; H05K1/11

Abstract:
A ceramic electronic component of the present disclosure includes a component body including a ceramic layer, at least one terminal electrode provided on one main surface of the component body, and an insulating covering layer provided across the ceramic layer and the terminal electrode to cover part, instead of an entire circumference, of a peripheral edge portion of the terminal electrode, wherein when viewed in plan view from one main surface of the component body, the covering layer intersects with the terminal electrode at a non-perpendicular angle at an intersection of the covering layer and the terminal electrode not covered with the covering layer.
Public/Granted literature
- US20210259104A1 CERAMIC ELECTRONIC COMPONENT Public/Granted day:2021-08-19
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