Invention Grant
- Patent Title: Stack-type vertical heat dissipation device
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Application No.: US17130758Application Date: 2020-12-22
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Publication No.: US11659687B2Publication Date: 2023-05-23
- Inventor: Cheng-Chien Wan , Cheng-Jui Wan , Chun-Hsien Su , Hui-Fen Huang
- Applicant: Man Zai Industrial Co., LTD.
- Applicant Address: TW Tainan
- Assignee: MAN ZAI INDUSTRIAL CO., LTD.
- Current Assignee: MAN ZAI INDUSTRIAL CO., LTD.
- Current Assignee Address: TW Tainan
- Agency: Muncy, Geissler, Olds & Lowe, P.C.
- Priority: TW 9130953 2020.09.09
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28D15/02 ; F28D15/04 ; F28D21/00

Abstract:
The present invention provides a stack-type vertical heat dissipation device comprising an evaporator unit and a condenser unit. The evaporator unit has a side configured for direct or indirect contact with, and thereby receiving heat from, a high-temperature device in order for the heat to convert a heat conduction medium inside the evaporator unit into a gaseous state. The condenser unit is stacked on a top side of a housing of the evaporator unit, and is provided therein with a flow channel that is in communication with the evaporator unit and allows passage of the heat conduction medium so that the heat conduction medium is able to return to the evaporator unit under a force of gravity after condensing from the gaseous state into a liquid state and thereby complete a thermal cycle.
Public/Granted literature
- US20220078943A1 STACK-TYPE VERTICAL HEAT DISSIPATION DEVICE Public/Granted day:2022-03-10
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