Invention Grant
- Patent Title: Heatsink assembly for an electronic device
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Application No.: US16970346Application Date: 2019-02-19
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Publication No.: US11659689B2Publication Date: 2023-05-23
- Inventor: Darin Bradley Ritter
- Applicant: InterDigital Madison Patent Holdings, SAS
- Applicant Address: FR Paris
- Assignee: InterDigital Madison Patent Holdings, SAS
- Current Assignee: InterDigital Madison Patent Holdings, SAS
- Current Assignee Address: FR Paris
- Agency: Condo Roccia Koptiw LLP
- International Application: PCT/IB2019/000218 2019.02.19
- International Announcement: WO2019/159014A 2019.08.22
- Date entered country: 2020-08-15
- Main IPC: H05K7/20
- IPC: H05K7/20 ; F28F13/06
Abstract:
A heatsink assembly for an electronic device is described. The heatsink assembly includes a shield, a thermally conductive spacer and a heatsink. The shield has at least one indentation on a surface thereof that is positioned over a component needing thermal dissipation that is attached to the printed circuit board. The thermally conductive spacer is 5 positioned within the at least one indentation on the shield. The heatsink is positioned over the thermally conductive spacer and fastened to the printed circuit board.
Public/Granted literature
- US20210092867A1 HEATSINK ASSEMBLY FOR AN ELECTRONIC DEVICE Public/Granted day:2021-03-25
Information query
