Invention Grant
- Patent Title: Molded power module with integrated exciter circuit
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Application No.: US17031673Application Date: 2020-09-24
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Publication No.: US11659698B2Publication Date: 2023-05-23
- Inventor: Daniel Ruppert
- Applicant: AUDI AG
- Applicant Address: DE Ingolstadt
- Assignee: AUDI AG
- Current Assignee: AUDI AG
- Current Assignee Address: DE Ingolstadt
- Agency: Seed IP Law Group LLP
- Priority: DE 2019125733.6 2019.09.25
- Main IPC: H05K7/20
- IPC: H05K7/20 ; H05K7/14 ; H01L23/31 ; H01L23/36 ; H02M1/32 ; H01L23/433 ; H01L23/473 ; H02M7/00

Abstract:
A power module for electric drives is provided which comprises at least one exciter circuit with at least one power semiconductor, wherein the power module is molded and the exciter circuit with the at least one power semiconductor is integrated in the molded power module. A traction inverter is also provided which comprises a water-cooled main cooler, wherein the main cooler comprises a bearing surface which is configured to receive power modules, wherein the traction inverter comprises at least one molded power module, and wherein the main cooler forms a cooling connection which is configured to receive the molded power module on the main cooler.
Public/Granted literature
- US20210092882A1 MOLDED POWER MODULE WITH INTEGRATED EXCITER CIRCUIT Public/Granted day:2021-03-25
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