Invention Grant
- Patent Title: Semiconductor device
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Application No.: US17381768Application Date: 2021-07-21
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Publication No.: US11659719B2Publication Date: 2023-05-23
- Inventor: Kilho Lee , Gwanhyeob Koh
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Gyeonggi-do
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: KR 20190122468 2019.10.02
- Main IPC: H01L27/00
- IPC: H01L27/00 ; H01L27/22 ; G11C11/02 ; G11C11/56

Abstract:
A semiconductor device including a substrate that has a first region and a second region, a plurality of lower conductive patterns on the substrate, the plurality of lower conductive patterns including a first conductive pattern in the first region of the substrate and a second conductive pattern in the second region of the substrate, a magnetic tunnel junction on the first conductive pattern, a contact between the magnetic tunnel junction and the first conductive pattern, a through electrode on the second conductive pattern, and a plurality of upper conductive patterns on the magnetic tunnel junction and the through electrode. The contact includes a first contact on the lower conductive patterns, a second contact on the first contact, and a first barrier layer that covers a bottom surface and a lateral surface of the second contact.
Public/Granted literature
- US20210351233A1 SEMICONDUCTOR DEVICE Public/Granted day:2021-11-11
Information query
IPC分类: