Invention Grant
- Patent Title: High temperature-superconducting wire having superconducting layer staked thereon and method for manufacturing same
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Application No.: US16890011Application Date: 2020-06-02
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Publication No.: US11659776B2Publication Date: 2023-05-23
- Inventor: Hong Soo Ha , Sang Soo Oh , Sung Kyu Kim
- Applicant: Korea Electrotechnology Research Institute
- Applicant Address: KR Changwon-si
- Assignee: Korea Electrotechnology Research Institute
- Current Assignee: Korea Electrotechnology Research Institute
- Current Assignee Address: KR Changwon-si
- Agency: Park & Associates IP Law Office
- Priority: KR 20180041360 2018.04.10
- Main IPC: H01B12/06
- IPC: H01B12/06 ; H01F6/06

Abstract:
The present invention relates to a high temperature-superconducting wire having a superconducting layer laminated thereon and a method of manufacturing the same. The method includes: preparing a pair of superconducting wires each of which includes a metal substrate, a buffer layer, a superconducting layer, and a protective layer; laminating the pair of superconducting wires to allow respective protective layers to face each other; performing thermal treatment to the laminated superconducting wires to join the protective layers together; separating the metal substrate and the buffer layer from the superconducting layer on one side; and forming a protective layer on an upper part of the superconducting layer having a surface exposed. The present invention provides a high temperature-superconducting wire which includes a plurality of biaxially textured superconducting layers laminated thereby improving electro-conductivity, wherein the plurality of superconducting layers are separated from each other thereby reducing a loss of alternating current.
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