An enclosure configured to hermetically seal electronics of a surgical instrument therein includes a first casing component defining a first weld deck about a perimeter thereof, a second casing component defining a second weld deck about a perimeter thereof, and an energy director extending from the first weld deck and configured to facilitate ultrasonic welding of the first and second weld decks of the first and second casing components, respectively, with one another to establish a weld seam hermetically sealing the first and second casing components. The first weld deck lies in multiple planes.