Invention Grant
- Patent Title: Methods of bonding components to polymeric substrates
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Application No.: US16760641Application Date: 2018-11-01
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Publication No.: US11666729B2Publication Date: 2023-06-06
- Inventor: Horacio Montes De Oca Balderas , Eamonn Casey , Claire McKenna , John P. O'Mahony
- Applicant: Hollister Incorporated
- Applicant Address: US IL Libertyville
- Assignee: Hollister Incorporated
- Current Assignee: Hollister Incorporated
- Current Assignee Address: US IL Libertyville
- Agency: Cook Alex Ltd.
- International Application: PCT/US2018/058623 2018.11.01
- International Announcement: WO2019/089875A 2019.05.09
- Date entered country: 2020-04-30
- Main IPC: A61M25/00
- IPC: A61M25/00 ; B29C65/48 ; B29C65/00 ; C08J5/12 ; C08J7/056 ; C08J7/02
Abstract:
Methods for bonding polymeric substrates to component parts, and medical devices assemblies including a tubing and a component part bonded together using a solvent containing a tackifier.
Public/Granted literature
- US20200345973A1 METHODS OF BONDING COMPONENTS TO POLYMERIC SUBSTRATES Public/Granted day:2020-11-05
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