Invention Grant
- Patent Title: Swing measuring attachment, and swing measuring apparatus
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Application No.: US17210558Application Date: 2021-03-24
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Publication No.: US11666811B2Publication Date: 2023-06-06
- Inventor: Atsushi Kondo , Takeshi Fujishiro
- Applicant: Seiko Epson Corporation
- Applicant Address: JP Toyko
- Assignee: Seiko Epson Corporation
- Current Assignee: Seiko Epson Corporation
- Current Assignee Address: JP Toyko
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: JP 2020053838 2020.03.25
- Main IPC: A63B60/46
- IPC: A63B60/46 ; G01P13/00 ; A63B60/16 ; A63B53/14
Abstract:
A swing measuring attachment includes a base portion and a protrusion protruding from the base portion, in which the protrusion is provided with a screw thread, the protrusion including a projection at a front end of the protrusion.
Public/Granted literature
- US20210299531A1 Swing Measuring Attachment, And Swing Measuring Apparatus Public/Granted day:2021-09-30
Information query
