Invention Grant
- Patent Title: Microfluidic package
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Application No.: US16608408Application Date: 2017-09-14
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Publication No.: US11666908B2Publication Date: 2023-06-06
- Inventor: Chien-Hua Chen , Michael W. Cumbie
- Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2017/051467 2017.09.14
- International Announcement: WO2019/055007A 2019.03.21
- Date entered country: 2019-10-25
- Main IPC: B01L3/00
- IPC: B01L3/00 ; B29C70/68 ; B29K63/00 ; B29L31/00

Abstract:
A microfluidic package may include a fluid passage, a substrate having a substrate surface adjacent an interior of the fluid passage and components inset in the substrate, the components having component surfaces adjacent the fluid passage and substantially flush with the substrate surface.
Information query
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