Invention Grant
- Patent Title: Laser machining apparatus and laser machining method
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Application No.: US17285169Application Date: 2019-10-08
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Publication No.: US11666991B2Publication Date: 2023-06-06
- Inventor: Yoichi Tanaka , Chiaki Kawahara
- Applicant: AMADA CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: AMADA CO., LTD.
- Current Assignee: AMADA CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Renner, Otto, Boisselle & Sklar, LLP
- Priority: JP 2018198451 2018.10.22
- International Application: PCT/JP2019/039596 2019.10.08
- International Announcement: WO2020/085073A 2020.04.30
- Date entered country: 2021-04-14
- Main IPC: B23K26/38
- IPC: B23K26/38 ; B23K26/082 ; B23K26/70 ; B23K101/18

Abstract:
A moving mechanism relatively moves a machining head emitting a laser beam, with respect to a sheet metal along a surface of the sheet metal. A beam vibrating mechanism vibrates the laser beam for irradiation on the sheet metal in a predetermined vibration pattern, while the machining head is relatively moved by the moving mechanism. A vibration control section controls the beam vibrating mechanism to progressively reduce an amplitude of the vibration pattern from a first position to a corner portion when the machining head moves toward the corner portion and reaches the first position before the corner portion by a predetermined distance, and progressively increase the amplitude of the vibration pattern until the machining head reaches a second position ahead of the corner portion by the predetermined distance from the corner portion, at a time of producing a product having the corner portion.
Public/Granted literature
- US20210339342A1 LASER MACHINING APPARATUS AND LASER MACHINING METHOD Public/Granted day:2021-11-04
Information query
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