Invention Grant
- Patent Title: Methods of making a polycrystalline diamond structure
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Application No.: US16381274Application Date: 2019-04-11
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Publication No.: US11667011B2Publication Date: 2023-06-06
- Inventor: David P. Miess
- Applicant: US SYNTHETIC CORPORATION
- Applicant Address: US UT Orem
- Assignee: US SYNTHETIC CORPORATION
- Current Assignee: US SYNTHETIC CORPORATION
- Current Assignee Address: US UT Orem
- Agency: Dorsey & Whitney LLP
- The original application number of the division: US14463587 2014.08.19
- Main IPC: B24D3/02
- IPC: B24D3/02 ; B24D18/00 ; B23C5/10 ; B22F5/08 ; B24D99/00 ; C22C26/00 ; B22F7/06 ; B22F3/14 ; B23G5/06 ; E21B10/573 ; B24D3/00 ; B24D11/00 ; B22F5/00 ; B23B51/00
Abstract:
Embodiments of the invention relate to methods of making articles having portions of polycrystalline diamond bonded to a surface of a substrate and polycrystalline diamond compacts made using the same. In an embodiment, a molding technique is disclosed for forming cutting tools comprising polycrystalline diamond portions bonded to the outer surface of a substrate.
Public/Granted literature
- US20190232463A1 POSITIVE RELIEF FORMING OF POLYCRYSTALLINE DIAMOND STRUCTURES AND RESULTING CUTTING TOOLS Public/Granted day:2019-08-01
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