Invention Grant
- Patent Title: Fluidic die with monitoring circuit fault protection structure
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Application No.: US17046877Application Date: 2018-05-15
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Publication No.: US11667128B2Publication Date: 2023-06-06
- Inventor: Eric Martin , Terry McMahon , Donald W Schulte
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agency: Foley & Lardner LLP
- International Application: PCT/US2018/032763 2018.05.15
- International Announcement: WO2019/221706A 2019.11.21
- Date entered country: 2020-10-12
- Main IPC: B41J2/175
- IPC: B41J2/175 ; H01L23/62 ; H01L27/092 ; H01L29/06 ; H03K17/687

Abstract:
A fluidic die includes fluid chambers, each including an electrode exposed to an interior of the fluid chamber and each having a corresponding fluid actuator operating at a high voltage. The fluidic die further includes monitoring circuitry, operating at a low voltage relative to the fluid actuator, to monitor a condition of each fluid chamber, for each chamber the monitoring circuitry including a connection structure and a select transistor and a pulldown transistor connected to the electrode via the connection structure. The connection structure and select and pulldown transistors together structured to form electrically conductive paths with electrical resistances to protect at least the select transistor from fault damage if the high voltage fluid actuator short-circuits to the electrode.
Public/Granted literature
- US20210146695A1 FLUIDIC DIE WITH MONITORING CIRCUIT FAULT PROTECTION STRUCTURE Public/Granted day:2021-05-20
Information query
IPC分类: