Invention Grant
- Patent Title: Method of constructing a micromechanical device
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Application No.: US16550495Application Date: 2019-08-26
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Publication No.: US11667521B2Publication Date: 2023-06-06
- Inventor: Yang Lu , Libo Gao , Sufeng Fan , Yuejiao Wang
- Applicant: City University of Hong Kong
- Applicant Address: HK Kowloon
- Assignee: City University of Hong Kong
- Current Assignee: City University of Hong Kong
- Current Assignee Address: HK Kowloon
- Agency: Renner Kenner Greive Bobak Taylor & Weber
- Main IPC: B81B7/02
- IPC: B81B7/02 ; B82B3/00 ; B81C1/00 ; B33Y10/00 ; B33Y80/00 ; B29C64/393 ; B29C64/129 ; B82Y35/00 ; B82Y40/00 ; B82Y30/00

Abstract:
A method of constructing a micromechanical device by additive manufacturing for characterizing strength of a low dimensional material sample, the method including: a) deriving a three-dimensional representation arranged to represent a said micromechanical device with reference to at least one physical characteristic of a said low dimensional material sample; b) transforming the three-dimensional representation into a plurality of two-dimensional representations arranged to individually represent a portion of the three-dimensional representation; and c) forming the micromechanical device from a fluid medium arranged to transform its physical state by stereolithography apparatus in response to a manipulated illumination exposed thereto, whereby a said low dimensional material sample is loaded onto the formed micromechanical device.
Public/Granted literature
- US20210061646A1 METHOD OF CONSTRUCTING A MICROMECHANICAL DEVICE Public/Granted day:2021-03-04
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