Invention Grant
- Patent Title: Photocurable resin composition
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Application No.: US17387853Application Date: 2021-07-28
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Publication No.: US11667741B2Publication Date: 2023-06-06
- Inventor: Emi Oishi
- Applicant: CANON KABUSHIKI KAISHA
- Applicant Address: JP Tokyo
- Assignee: Canon Kabushiki Kaisha
- Current Assignee: Canon Kabushiki Kaisha
- Current Assignee Address: JP Tokyo
- Agency: Canon U.S.A., Inc., IP Division
- Priority: JP 2020130784 2020.07.31 JP 2021107654 2021.06.29
- Main IPC: C08F2/46
- IPC: C08F2/46 ; C08F2/50 ; C08G61/04 ; C08F220/28 ; C08F222/10 ; C08F222/20 ; B29C64/129 ; B33Y70/00 ; C08K5/5397 ; B33Y10/00

Abstract:
A curable resin composition which provides a cured product excellent in impact resistance and flexural modulus and has a low viscosity comprising a component (A), a component (B) and a component (C). The component (A) is a compound represented by formula (1),
wherein in formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms, and the hydrocarbon group optionally has a substituent, wherein the component (B) is a compound having 3 or more to 15 or less of oxyethylene groups or oxypropylene groups and two or more radically polymerizable groups per molecule, and wherein the component (C) is a radical polymerization initiator.
wherein in formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms, and the hydrocarbon group optionally has a substituent, wherein the component (B) is a compound having 3 or more to 15 or less of oxyethylene groups or oxypropylene groups and two or more radically polymerizable groups per molecule, and wherein the component (C) is a radical polymerization initiator.
Public/Granted literature
- US20220033554A1 PHOTOCURABLE RESIN COMPOSITION Public/Granted day:2022-02-03
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