Photocurable resin composition
Abstract:
A curable resin composition which provides a cured product excellent in impact resistance and flexural modulus and has a low viscosity comprising a component (A), a component (B) and a component (C). The component (A) is a compound represented by formula (1),




wherein in formula (1), R is hydrogen or a hydrocarbon group having 1 to 4 carbon atoms, and the hydrocarbon group optionally has a substituent, wherein the component (B) is a compound having 3 or more to 15 or less of oxyethylene groups or oxypropylene groups and two or more radically polymerizable groups per molecule, and wherein the component (C) is a radical polymerization initiator.
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