Invention Grant
- Patent Title: Curable composition, curable paste material, curable sheet material, curable modeling material, curing method, and cured product
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Application No.: US16636673Application Date: 2017-08-29
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Publication No.: US11667748B2Publication Date: 2023-06-06
- Inventor: Noriya Hayashi , Toshikatsu Sakakibara , Yusuke Kobayashi , Tatsuya Kimura
- Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee: MITSUBISHI HEAVY INDUSTRIES, LTD.
- Current Assignee Address: JP Tokyo
- Agency: Kanesaka Berner and Partners LLP
- International Application: PCT/JP2017/030905 2017.08.29
- International Announcement: WO2019/043778A 2019.03.07
- Date entered country: 2020-02-05
- Main IPC: C08G59/24
- IPC: C08G59/24 ; C08G59/02 ; C08G65/18 ; C08K5/375 ; C08K3/36 ; C08G59/22 ; C08G65/22 ; C08G59/68 ; C08L63/00

Abstract:
A curable composition of the present invention includes a cationic polymerizable compound; a thermal polymerization initiator; and a storage stabilizer, in which the cationic polymerizable compound includes at least two selected from the group consisting of a glycidyl ether compound, an alicyclic epoxy compound, and an oxetane compound, a content of the thermal polymerization initiator is from 0.3 to 3 parts by mass with respect to 100 parts by mass of the cationic polymerizable compound, and chain curing is enabled by thermal energy generated by a polymerization reaction of the cationic polymerizable compound.
Information query
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