Invention Grant
- Patent Title: Encapsulating or filling composition for electronic devices and electronic apparatus
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Application No.: US17202957Application Date: 2021-03-16
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Publication No.: US11667786B2Publication Date: 2023-06-06
- Inventor: Wonmin Yun , Yohan Kim , Jongjin Park , Byoungduk Lee , Yunah Chung , Yoonhyeung Cho , Youngcheol Joo , Yongchan Ju
- Applicant: SAMSUNG DISPLAY CO., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: F. Chau & Associates, LLC
- Priority: KR 20200034044 2020.03.19
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/50 ; C08L63/10 ; C08L63/00 ; C08G59/70 ; C08G59/14 ; C08G59/44 ; C08G59/50 ; C08G59/68 ; C08L63/04 ; C08K5/00
Abstract:
Provided are an encapsulating or filling composition for electronic devices and an electronic apparatus. The encapsulating or filling composition includes a curable material containing an epoxy group, a polymerization initiator, and a metal catalyst. The electronic apparatus includes a first substrate, an electronic device disposed on the first substrate, and one or more cured materials of the encapsulating or filling composition formed on the electronic device.
Public/Granted literature
- US20210292546A1 ENCAPSULATING OR FILLING COMPOSITION FOR ELECTRONIC DEVICES AND ELECTRONIC APPARATUS Public/Granted day:2021-09-23
Information query
IPC分类:
