Invention Grant
- Patent Title: Polyamide resin composition and polyamide resin molded article
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Application No.: US17640973Application Date: 2020-09-09
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Publication No.: US11667789B2Publication Date: 2023-06-06
- Inventor: Yoshitaka Ayuzawa , Kensaku Maeda , Ryo Umeki
- Applicant: TOYOBO CO., LTD.
- Applicant Address: JP Osaka
- Assignee: TOYOBO CO., LTD.
- Current Assignee: TOYOBO CO., LTD.
- Current Assignee Address: JP Osaka
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP 2019166127 2019.09.12
- International Application: PCT/JP2020/034062 2020.09.09
- International Announcement: WO2021/049511A 2021.03.18
- Date entered country: 2022-03-07
- Main IPC: C08L77/00
- IPC: C08L77/00

Abstract:
A polyamide resin composition containing a polyimide resin (A), a modified styrene-based copolymer (B), a modified high-density polyethylene (C), and an aliphatic metal salt (D), and having a melt mass flow rate (MFR) of 20 g/10 minutes or more and less than 60 g/10 minutes and a 65% RH equilibrium water absorption rate of less than 3%. The polyamide resin composition can form a molded article having a sufficiently high limit of fatigue against continuous load, achieve high mechanical characteristics and high fluidity to prevent the occurrence of a short shot or decrease in the strength of a welded part even in a large and/or thick molded article, and has excellent mold releasability and more excellent abrasion resistance than ever before.
Public/Granted literature
- US20220267597A1 POLYAMIDE RESIN COMPOSITION AND POLYAMIDE RESIN MOLDED ARTICLE Public/Granted day:2022-08-25
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