Disclosed herein in is a radiative cooling formulation including a first component with >55% reflectance in a wavelengths range of 0.3 to 2.5 microns, a second component with a first thermal emissivity peak value greater than 0.85 at a first wavelength in a range of 8 to 13 microns (μm), and a third component to mechanically bind together a mixture of the first component and second component.