In this invention, a copper powder to which phosphorus (P) is added is developed such that a high-density laminated and shaped product can be obtained by a laminating and shaping method using a fiber laser as a heat source by appropriately reducing the electrical conductivity of copper, so a laminated and shaped product having a high density and a high electrical conductivity can be obtained. This invention is a copper powder for lamination shaping in which a phosphorus element is added to pure copper. The copper powder desirably contains 0.01 wt % or more of the phosphorus element. The copper powder more desirably contains 0.04 wt % or more of the phosphorus element. The copper powder desirably contains 0.30 wt % or less of the phosphorus element. The copper powder more desirably contains 0.24 wt % or less of the phosphorus element. No element other than the phosphorus element is desirably added to the copper powder.