Invention Grant
- Patent Title: Liner assemblies for substrate processing systems
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Application No.: US17162729Application Date: 2021-01-29
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Publication No.: US11668006B2Publication Date: 2023-06-06
- Inventor: Arash Abedijaberi , Shawn George Thomas
- Applicant: GlobalWafers Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: GlobalWafers Co., Ltd.
- Current Assignee: GlobalWafers Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: Armstrong Teasdale LLP
- The original application number of the division: US14176263 2014.02.10
- Main IPC: C23C16/00
- IPC: C23C16/00 ; H01L21/00 ; C23C16/455 ; H01J37/32

Abstract:
A liner assembly for a substrate processing system includes a first liner and a second liner. The first liner includes an annular body and an outer peripheral surface including a first fluid guide. The first fluid guide is curved about a circumferential line extending around the first liner. The second liner includes an annular body, an outer rim, an inner rim, a second fluid guide extending between the outer rim and the inner rim, and a plurality of partition walls extending outwardly from the second fluid guide. The second fluid guide is curved about the circumferential line when the first and second liners are positioned within the processing system.
Public/Granted literature
- US20210147980A1 LINER ASSEMBLIES FOR SUBSTRATE PROCESSING SYSTEMS Public/Granted day:2021-05-20
Information query
IPC分类: