Invention Grant
- Patent Title: Simultaneous localization and mapping (SLAM) using dual event cameras
-
Application No.: US17176500Application Date: 2021-02-16
-
Publication No.: US11668571B2Publication Date: 2023-06-06
- Inventor: Sebastien Derhy , Lior Zamir , Nathan Henri Levy
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. Chau & Associates, LLC
- Main IPC: G01C21/20
- IPC: G01C21/20 ; G06T7/579 ; G01C21/00 ; G06T7/73 ; A61B1/00 ; G06V10/75 ; G06V10/44 ; G06V20/56 ; G01C21/16

Abstract:
A method for simultaneous localization and mapping (SLAM) employs dual event-based cameras. Event streams from the cameras are processed by an image processing system to stereoscopically detect surface points in an environment, dynamically compute pose of a camera as it moves, and concurrently update a map of the environment. A gradient descent based optimization may be utilized to update the pose for each event or for each small batch of events.
Public/Granted literature
- US20210190497A1 SIMULTANEOUS LOCATION AND MAPPING (SLAM) USING DUAL EVENT CAMERAS Public/Granted day:2021-06-24
Information query
IPC分类: